Specially treated polymide film backed tape incorporating a silicone adhesive. The product's low static properties can eliminate circuit board degradation due to electrostatic discharge.   PRODUCT FEATURES Thin and conformable enabling masking of uneven surfaces Wide operating temperature range up to 500° F Removes cleanly without adhesive residue after exposure to heat/chemicals High strength backing provides superior puncture and tear Resistance to chemical attack High performance silicone adhesive TYPICAL APPLICATION: High temperature masking Protection of circuit board gold finger contacts during wave solder or hot air leveling process Used in applications where electrostatic discharge is a concern